Back to News List

GSPK Circuits is pleased to announce the latest equipment installation

A New Copper Filling line which will increase our capacity by 300%

The new line will also improve the technical capability for Copper Filled Vias and Direct Thermal Exchange Technology. Improved solution exchange and void-free filling of higher aspect ratio vias will be possible with this new technology.

What are the benefits of Copper-filled vias?

  • Improved Thermal Management
  • Increased Electrical Performance
  • Improved Reliability
  • Improved Surface Planarity
Bus Barz

Date : 02-08-2024