HDI PCBs

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HDI PCBs

High-Density Interconnect PCB

What is an HDI printed circuit board?

An HDI PCB (High-Density Interconnect PCB) stands out with significantly greater wiring density compared to traditional through-hole PCBs. As specified in IPC-6012, it is characterised by an average of at least 20 electrical connections per square centimetre on both sides of the board, enabling compact and complex designs.

HDI boards are commonly used to achieve smaller, lighter, more powerful and reliable electronic devices by utilising multiple layers, fine tracks and gaps, microvias, and blind and buried vias. With HDI a shorter signal path ensures power loss is less, and therefore its overall electrical performance is better which supports high-speed signals and improved signal integrity which is essential many cutting-edge technology products.

HDI PCBs

Features

HDI PCBs (High-Density Interconnect Printed Circuit Board)should follow IPC2226, the standard for design such PCBs including features such as:

  • Microvias: Laser-drilled vias with a diameter typically less than 150 microns, enabling compact interconnections between layers.
  • Blind/Buried Vias: Vias that connect specific layers without traversing the entire PCB, saving space and optimising design.
  • Thinner Lines and Spaces: Enhanced density through fine conductor widths and spaces, often less than 100 microns.
  • Multiple Layers: Designs utilising stacked, staggered, or sequential layers to maximize component density.
HDI PCBs

HDI Capabilities

Feature Technical Specification
Max layer count 22, advanced 50
PCB thickness 0.3mm - 4.5mm
PCB size 50 x 50mm - 700 x 600mm
Max copper thickness Outer layer:6OZ   Inner layer: 6OZ
Minimum hole size 0.1mm, advanced 0.075MM
Max hole size 3.5mm
Tighest hole tolerence PTH：±0.075MM, NPTH：±0.05MM  
Min track width 0.762mm
Min gap 0.762mm
Finishes OSP, ENIG, ENEPIG, EPAG, Immersion tin, Immersion Silver
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