Home > Manufacturing > Equipment Capabilities |
Anything is Possible
Standard | Advanced | |
Single Sided | Max. 510 x 610mm | |
Double Sided Non PTH | Max. 510 x 610mm | |
Silver Through Hole | Max. 510 x 610mm | |
PTH | Max. 457 x 610mm | Max. 610 x 1000mm |
Multilayer | Max. 457 x 610mm | Max. 610 x 1000mm |
Layer count | Up to 20 | Up to 58 |
Standard | Advanced | |
FR1 | Yes | Yes |
FR2 | Yes | Yes |
CEM-1 | Yes | Yes |
CEM-3 | Yes | Yes |
FR4 (Standard & Hi-TG) | ITEQ, Kingboard, Shengyi, Nanya, Grace, Isola, Ventec, EMC | Nelco, Rogers, Panasonic, Taconic, Ventec, EMC, others available on request |
Aluminium | Denka, Bergquist, Laird, Ventec | Denka, Bergquist, Laird, Ventec |
Pre-pregs | 106, 1080, 2113, 2116, 2125, 7628 | 106, 1080, 2113, 2116, 2125, 7628, 106NF, 1080NF |
Other Materials | Please Enquire | Please Enquire |
Standard | Advanced | |
Single Sided | 1oz (35µm) - 2oz (70µm) | 30oz (Thirty) (1050µm)* |
PTH | 1oz (35µm) - 30oz (1050µm) | 30oz (1050µm)* |
Multilayer (Outer layers) | 1µm - 6oz (210µm) | 6oz (1050µm)* |
Multilayer (Inner Layers) | ½oz (18µm) – 6oz (210µm) | 15oz (525µm)* |
Metal Clad PCB | 1oz (35µm) – 6oz (210µm) | 12oz (420µm)* |
ASPECT RATIO | 10:01 | 16:01 |
Standard | Advanced | |
Hot Air Solder Level | Yes | Yes |
Lead Free Hot Air Solder Level | Yes | Yes |
ENEPIG | Yes | Yes |
EPAG | Yes | Yes |
Immersion Gold (ENIG) | Yes | Yes |
Immersion Silver | Yes | Yes |
Immersion Tin | Yes | Yes |
Hard Gold & Gold Finger | Yes | Yes |
OSP | Yes | Yes |
Standard | Advanced | |
Photoimageable (LPI) Solder Mask | Green, Blue, White, Black | Red, Orange, Purple, Grey & Others on request |
Via Plugging | Yes | Yes |
Peelable Solder Mask | Standard & Hi-Temp-Blue, Green, Red | Standard & Hi-Temp-Blue, Green, Red |
UV Curable ident (Silkscreen) | White, Yellow, Black | Green, Red, Blue, Brown |
Carbon Key Pads | Yes | Yes |
Carbon Links | No | Yes |
Standard | Advanced | |
Min. Finished Hole Size (Mechanical) | 0.20mm | 0.15mm |
Min. Finished Hole Size (Laser) | 0.10mm | 0.05mm |
Minimum Punched Hole Size | 0.80mm | 0.70mm |
Standard | Advanced | |
Track & Gap | ±20% | ±10% |
Layer Registration | ±0.10mm | ±0.10mm |
Standard | Advanced | |
Hole Diameter (PTH) | ±0.075mm | ±0.050mm |
Hole Diameter (Non-PTH) | ±0.10mm | ±0.050mm |
Hole Diameter (Punched) | ±0.15mm | ±0.10mm |
Hole Location | ±0.05mm |
Standard | Advanced | |
Track & Gap | ±20% | ±10% |
Standard | Advanced | |
Via Plugging (100% Fill) | –20% | -10% |
Via Size | ≤0.50mm | ≤0.60mm |
Registration | 0.025mm | 0.020mm |
Solder Dam Width | Min. 0.15mm | Min. 0.10mm |
Thickness Over Trace (Surface) | Min. 10µm | Min. 15µm |
Solder Mask Pad Size | Min. 15µm |
Standard | Advanced | |
Maximum board thickness | 6.00mm | 10.00mm |
Minimum board thickness | 0.30mm | 0.20mm |
Minimum Track / Gap Inner layer | 0.10mm | 0.05mm |
Minimum Track / Gap Outer layer (35µm) | 0.10mm | 0.05mm |
Finished PCB Thickness | ±10% | |
Routing Profile | ±0.15mm | ±0.10mm |
V-Cut profile | ±0.15mm | ±0.10mm |
Standard | Advanced | |
% Tested (Open / Short test) | 100% | 100% |
QFP Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
BGA Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
Connector Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
Standard | Advanced | |
AOI | All Multilayer | All Multilayer |
Impedance Control | ± 10% | ± 5% |
Solderability Testing | As standard | As standard |
Ionic Contamination | On Request | On Request |
Micro Section and Micro Section Report | On Request | On Request |
XRAY and XRF | On Request | On Request |
PLATED SLOTS – EDGE PLATING – COUNTERSINKING – EDGE BEVELLING – JUMP SCORING – BARCODING – COUNTERBORING – DEPTH ROUTINGDEPTH DRILLED VIAS BLIND AND BURIED |
OTHERS AVAILABLE ON REQUEST |
Board Type | Standard | Quick Turn |
Single Sided | 10 Days | 48 Hrs |
PTH | 10 Days | 48 Hrs |
Multilayer | From 10 Days | From 3 Days |
Board Type | Manufacturing Lead Time |
Quick Turn ≤ 5sqft | From 5 Days |
Single Sided | 10 – 20 Days dependant on volume |
PTH | 15 – 25 Days dependant on volume |
Multilayer | 15 – 30 Days dependant on volume & Technology |
Air Freight Lead Time – 4 Days |
Sea Freight Lead Time – 20 Days |
All Far East lead times are subject to customs clearance |
Premium International shipments can be arranged by DHL, Fedex, UPS or TNT at extra cost |
Our List of Capital Equipment
Fabtech Chemical Clean Line |
KST LED exposure unit |
Automatic Hakuto Cut Sheet Laminator |
Automatic Schmid Cut Sheet Laminator |
Manual Hand Laminator |
GSPK Engineering -- Develop -Acid etch - Strip line with Low Acid Copper Controller |
Camtek Orion AOI |
MIVA 2025L Duo Direct Imaging Machine |
Fabtech inner layer chemical prep line |
DIS inner layer camera alignment and welding system |
2 x 4 daylight Burkle presses with cooling press |
ABCON Xray drill |
7 Lenz drills with load / unload (2 with depth drilling and camera alignment) |
1 Lenz DRB 610 1+1 with depth control, camera alignment & automation |
Schmid Deburring Machine |
Fabtech Horizontal Chemical Desmear |
GSPK Engineering Horizontal Direct Metallisation Line |
Automated Viking (SP) Copper plating line (4 Copper Cells) with Reverse Pulse Plating |
Manual Copper Via Fill line (BV110) |
Fischer MMS PC2 Copper Measuring system |
Fischer Picascope Copper Measuring System |
UCE Horizontal Strip --Etch --Strip line with Vacuum Ammonia Etching Chamber |
Camtek Orion AOI |
UCE Solder Resist Preparation Line (MecEtch) with integrated panel cleaner |
DP10 and DP1500 vertical coating system |
Electrostatic spray for Extreme heavy copper |
Orbotech Sprint 150 Ink jet printer |
Microcraft ink jet printer |
ITC Resin Fill and planariser system |
KST LED exposure system |
Viking (SP) Automatic Vertical ENIG/ENIPIG line |
EPAG prototype line |
PPT Automatic Vertical Immersion Tin Line |
Muscat Horizontal Stirling Silver line |
Horizontal OSP line |
Cemco Quicksilver Lead Free HASL with Flux and cleaning lines |
2 Fischerscope XRF measuring systems |
6 Lenz routers --2 dedicated metal |
Engel EG-V12-2X CNC Scoring Machine - IMS |
Engel EG-V12-2X CNC Scoring Machine - FR4 |
ITP X-Y-Z measuring system |
Mondo X-Y-Z Measuring Table |
2 ATG A5 flying probe testers |
A3 ATG flying probe tester |
3 Speedy flying probe testers |
Mania fixture tower testers |
Polar instruments Impedance tester CITs 880s |
2 Optilia Video Inspection Stations |
Struers Automatic Microsection Preparation Equipment |
Struers Structure Expert Measuring and Archiving system |
Struers 200 X computerised camera inspection |
Accelerated Aging Equipment |
Solderability Equipment |
Peel / Pull Test Equipment |
Solvent Resistance Testing |
Clare Instruments Hi-Pot Testing |
2 x Vacuum packing systems |
The Factory has the ability to run 35% of the equipment, in the event of a major power cut, using an in house Diesel generator |